In our class 1000 cleanroom facility with automatic wire-bonding and surface mount assembly services we are equipped to take on the challenges posed by electronic systems and subsystems with increasing functionality, higher performance, smaller form factor, and lower cost. These requirements translate to higher level microelectronic fabrication and packaging challenges.
 
In this scenario, system-in-a-package (SiP) modules are consistently proving to be an alternative packaging solution to system-on-a-chip (SoC), providing the additional benefit of early time to market. As a packaging technology platform, SiP allows a high degree of flexibility in the package architecture. We provide services for IC design, IC package design, packaging, substrate mounting.